Device for delivering wafers processed in a plurality of chambers

The invention relates to the technology of delivering wafers in the semiconductor wafer machining process, in particular to a device for delivering the wafers processed in a plurality of chambers. The device mainly comprises a lifting motor, a lead screw, a lifting platform, a rotating motor, a rotating platform, at least three mechanical claws and driving mechanisms, wherein the driving mechanisms are used for driving the mechanical claws, and the number of the driving mechanisms is the same as the number of the mechanism claws. The device can go up and down, rotate and stretch out or draw back at the same time, the movement in the three directions is carried out in unit time, therefore, the wafers can be delivered to expected positions rapidly and accurately. Further, due to the fact that at least three mechanical claws are arranged, the problems that the wafers are cross-contaminated, the wafers are lifted too low, the delivering speed is low and the delivering efficiency is low when the wafers are delivered by a traditional wafer delivery device among a plurality of chambers are solved.