Direct method for bonding substrates with thinning of the edges of at least one of the two substrates

A method of direct bonding between at least first and second substrates (100, 102), each of the first and second substrates having first and second main faces (104, 106, 108, 110), comprising at least the steps of: - first thinning of edges (114) of the first substrate (100) on at least a portion of the circumference of the first substrate at the first main face (104) of the first substrate; - contacting the second main face (106) of the first substrate with the second main face (110) of the second substrate (102) such that a bonding wave is propagated between the first and second substrates, interconnecting the first and second substrates to one another by direct bonding.