Hybrid Metal/Polymer Wafer Bonding Platform

This chapter provides an overview of a hybrid metal/polymer wafer bonding plat- form using damascene-patterned intermediate layers for wafer bonding and elec- trical interconnections. This hybrid bonding platform combines the advantages of metal-to-metal bonding (for direct electrical interstrata interconnection) and polymer bonding (for robust thermomechanical wafer bonding strength and sur- face topography accommodation). Copper/benzocyclobutene (Cu/BCB) layers are selected for the demonstration vehicle. A detailed Cu/BCB bonding process base- line is described, and the results obtained are presented. The key issues of hybrid metal/polymer wafer bonding are discussed. hybrid wafer bonding, copper/benzocyclobutene (Cu/BCB) bonding, topography accommodation, three-dimensional integration, through-strata via (TSV), bonded interstrata via (BISV)