Perspectives in surface and interface analysis for electronic devices and circuits

Over the past two decades a variety of techniques have been developed for the analysis of surfaces and interfaces. Despite the multiplicity of interfaces in electronic devices however, and the need for precise control, surprisingly few of these techniques have had a major impact in the area. Scientific successes such as low energy electron diffraction (LEED) find little application, and a straightforward comparison of the strenths and weaknesses of Auger electron spectroscopy (AES) and x-ray photo-electron spectroscophy (XPS) gives little indication of the massive preference for the former in analysing devices and circuits. A similar disparity in usage has also arisen between dynamic and static SIMS, only the former being significant. It is also clear that several of the more important techniques can be used to analyse thin films as well as surfaces and interfaces. Further, that the techniques are often more quantitative in their application to films. Again it is surprising how little pressure there has been to minimise the shortcomings with respect to interface analysis. With the benefit of hindsight, some of the features that have led to certain techniques becoming particularly useful in application will be considered. Some new trends in device and circuit research which may increase the emphasis on surface and interface analysis will be identified. In this new area the growing importance of techniques such as transmission electron microscopy, not automatically included as a leading surface and interface analysis technique, will be illustrated.