Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package

Warpage and solder joint reliability of 2.5D and fan-out packages were investigated using Finite Element Method comparing with the flip chip package. It revealed that the warpage could be reduced to about 50% and the solder joint reliability could be increased to 1.2 times. Regarding the FO package, using the higher elastic modulus underfill material was effective to improve the both of the warpage and the solder joint reliability. It also indicated that the optimization of the combination of the material properties of underfill and the substrate core were required for the other two packages.