Old Web
English
Sign In
Acemap
>
Paper
>
Integrated microchannel cooling in a three dimensional integrated circuit: A thermal management
Integrated microchannel cooling in a three dimensional integrated circuit: A thermal management
2016
Kang-Jia Wang
Zhong-Liang Pan
Keywords:
Thermodynamics
Physics
Microchannel
Thermal management of electronic devices and systems
Three-dimensional integrated circuit
Electronic engineering
Classical mechanics
Mechanical engineering
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
3
Citations
NaN
KQI
[]