TAB multichip modules: a case study
1991
A case history of the design, development, and production of a commercial, high-performance multichip module at NCR Corporation is presented. Included is a brief description of NCR's strategy followed by design and manufacturing considerations encountered in the development of a tape automated bonded (TAB) module for volume production. These considerations include everything from developing sources for the components, to design for manufacturability requirements. >
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