A method of packaging at least one semiconductor device and semiconductor device

A method of packaging at least one semiconductor component (12) comprising the steps of: covering at least one partial surface (14) of the at least one semiconductor component (12) with at least one chemically or physically dissolvable sacrificial material (16); at least partially surrounding the at least one semiconductor component (12) with an optically abradable packing material (28), whereby at least the sacrificial material (16) on the at least one part surface (14) of the at least one semiconductor component (12) is surrounded with the packaging material (28); exposing the sacrificial material (16) on the at least one part surface (14) of the at least one semiconductor component (12) at least in part, by forming at least one trench (30) through at least the packaging material (28) by means of a light beam, wherein at least the packaging material (28) is partially optically removed; andexposing the at least one part surface (14) of the at least one semiconductor component (12) at least partly by an at least partial removal of the previously exposed sacrificial material (16) by means of a chemical or physical removal method, against which the packaging material (28) as compared with the sacrificial material (16 ) has a higher resistance; characterized in thatfor covering the at least one part surface (14) with at least the chemically or physically dissolvable sacrificial material (16), a sacrificial material layer (16a) of the sacrificial material (16) is deposited, and a photo-patternable layer (18a) made of a photo-patternable material (18) is deposited and patterned on the sacrificial material layer (16a), wherein of the photo-patternable layer (18a) is mitstrukturiert covered sacrificial material layer (16a) and the structuring of the sacrificial material layer (16a) and the photo-patternable layer (18a) so is made that only the at least one part surface (14) remain covering residual portions (16b and 18b) of the sacrificial material (16) and the photo-patternable material (18), wherein the patterned sacrificial material layer (16a) and the photo-patterned layer (18b ) on the at least one part surface (14) of the at least one semiconductor component (12) with the Verpackungsmateri al surrounded (28); andin forming the at least one trench (30) by means of the light beam and the at least a remaining region (18b) from the photo-patternable material (18) is at least partially removed.