Thin WLFO and based WLSiP enabling WL3D, realized using Temporary Reconstituted Panel Bonding Technology

The interest in FOWLP as new flexible packaging technology platform is continuously increasing. High volume capability is proven for configurations with single die (WLFO), multi-die side-by-side, partially with discrete passives integration (WLMCM and WLSiP), both with single sided single and multiple RDL layers. The next step to achieve higher integration density, e.g. for mobile and IoT applications, is to go in the third dimension (WL3D/WLPoP) with total package thickness below 1mm, targeting 0.8mm and even less in the next development step. High design flexibility, superior performance and small form-factor in x and y, but even more important in z-dimension, are the essential packaging characteristics required for this type of smart system integration. The eWLB based WLFO technology platform of NANIUM promises to deliver all of those requirements. While previous generations of WLFO packages only consisted of one plane of single or multiple RDL layers (frontside RDL at BGA side), recent evolutions enab...