Electronic device, electronic apparatus, and electronic device manufacturing method

An electronic device is provided which includes a base (10), a through-electrode (21) that passes through the base (10) and from which an insulating material on an end face thereof is removed by polishing, a circuit pattern (30) that is formed on an end face of the through-electrode (21), an electronic component (40) that is disposed via an internal wiring (31) formed on the circuit pattern (30), an electrode pattern (60) that is formed on the surface of the base opposite to the surface on which the electronic component (40) is disposed and that is connected to the other end face of the through-electrode (21), an external electrode (61) that is formed on the electrode pattern (60), and a cap (50) that is bonded to the base so as to protect the electronic component (40) on the base (10).