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Thermal Management Method for Chip-Scale Package Light-Emitting Diodes During Reliability Tests
Thermal Management Method for Chip-Scale Package Light-Emitting Diodes During Reliability Tests
2017
Byungjin Ma
Eung Suk Park
Hae Hyung Lee
Kwanhun Lee
Keywords:
Chip-scale package
Light-emitting diode
Thermal management of electronic devices and systems
Junction temperature
Electronic engineering
Thermal resistance
Materials science
Optoelectronics
Correction
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