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Resin encapsulation molding method and the mold apparatus of the electronic component
Resin encapsulation molding method and the mold apparatus of the electronic component
1994
takasi mare kuno
satosi zinpei
yosihisa kawamoto
makoto matuo
kouiti araki
Keywords:
Electronic component
Encapsulation (computer programming)
Mold
Molding (process)
Composite material
Materials science
Correction
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