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Led chip and preparation method

2013 
The present invention discloses an LED chip and a preparation method, the LED chip includes a substrate, a semiconductor epitaxial layer on the substrate, the transparent conductive layer on the semiconductor epitaxial layer, and the P electrode on the transparent conductive layer and N electrodes on an epitaxial layer of a semiconductor, the semiconductor epitaxial layer and the substrate wholly or partially provided as a continuous sidewall slope. In the present invention, without increasing the overall size of the chip, by designing improved, increasing the light emitting area of ​​the chip, and no additional process steps to maintain the original costs and enhance the optical properties of the chip.
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