Led chip and preparation method
2013
The present invention discloses an LED chip and a preparation method, the LED chip includes a substrate, a semiconductor epitaxial layer on the substrate, the transparent conductive layer on the semiconductor epitaxial layer, and the P electrode on the transparent conductive layer and N electrodes on an epitaxial layer of a semiconductor, the semiconductor epitaxial layer and the substrate wholly or partially provided as a continuous sidewall slope. In the present invention, without increasing the overall size of the chip, by designing improved, increasing the light emitting area of the chip, and no additional process steps to maintain the original costs and enhance the optical properties of the chip.
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