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Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module
Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module
2021
Tzu-Hsuan Cheng
Kenji Nishiguchi
Yoshi Fukawa
B. Jayant Baliga
Subhashish Bhattacharya
Douglas C. Hopkins
Keywords:
Composite material
Power module
Reliability (semiconductor)
Materials science
Thermal
Epoxy
characterization
Correction
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