Mechanical and Physical Property Changes of Cu-Ni-Si-Sn-Fe-P Copper Alloy System According to the Heat Treatment Conditions
2013
The influence of aging treatment, addition elements and rolling reduction ratio on the microstructure, mechanical, electrical and bendability properties of Cu-Ni-Si-P-x (x = Fe, Sn, Zn) alloys for connector material application was investigated. SEM/EDS analysis exhibited that Ni2-Si precipitates with a size of 20~100 nm were distributed in grains. Fe, Sn, Zn elemnets in Cu-Ni-Si-P alloy imporved the mechanical strength but it was not favor in increasing of electrical conductivity. As higher final rolling reduction ratio, the strength and electrical con- ductivity is increased after aging treatment, but it indicated excellent bendability. Especially, Cu-2Ni-0.4Si-0.5Sn- 0.1Fe-0.03P alloy show the tensile strength value of 700MPa and the electrical conductivity was observed to reach a maximum of 40%IACS. It is optimal for lead frame and connector. (Received July 15, 2012; Revised August 20, 2013; Accepted August 29, 2013)
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
4
References
0
Citations
NaN
KQI