Использование теплоизоляционных слоев из микромодулей в новых конструкциях стеновых панелей

The paper presents an analysis of requirements to existing heat-insulation layers in enclosure structures of wall panels has been carried out, a general principles on development of thermal insulation systems, substantiation on the necessity to develop a new wall panel design with improved thermal characteristics. The proposed design of the wall panel differs from the existing one in the fact that its external layer is made of protective sheets being perforated in their top and bottom parts with perforated aluminum foil layer placed on them. Air layer performs function of one of thermal insulation layers, and the second layer is made up in the form of several micro-modular sublayers which are divided by perforated aluminum foil and a grid. An inner concrete layer is also separated from micro-modular layers by aluminum foil. Protective sheets and the grid can be made of aluminum or polyethylene.The arrangement of hollow micro-modular cells in the zone of negative temperatures prevents condensate accumulation. The arrangement of the perforated aluminum foil layers between micro-modular layers leads to increase in thermal resistance of the panel due to decrease of a radiant component in presence of several screens and does not interfere with a vapor permeability of thermal insulation layers from micro-modules. At the same time placement of a non-perforated foil layer on an inside panel layer interferes with penetration of water vapor from rooms in micro-modular thermal insulation layers.Technological principles lie in the arrangement of perforation slots in the top and bottom zones of protective sheets that allows to delete excess moisture from thermal insulation layers and air layer and also leads to improvement of thermo-technical characteristics, durability and reliability in construction operation as a whole. The executed calculations of heat and humidity fields in external enclosure structures confirm advantages of the presented technical solution.