Improving thermal resistance of multilayer LTCC module with cooling channels and thermal vias

The aim of this paper is investigation of the flow analysis, the thermal resistance, and the distribution of coolant inside multilayer LTCC (Low Temperature Co-fired Ceramics) with embedded channels for power electronic devices. For this purpose LTCC multilayer structures with integrated channel and thermal vias are designed, measured, simulated and realized. The impact of the volume flow rate of coolant, internal structure of the multilayer substrate, and thermal vias on thermal resistance of design was simulated by using the simulation software Mentor Graphic FloEFD™, measured and analyzed. Thermal vias in the multilayer cooling structure and volume flow rate of coolant have a significant impact on thermal resistance, pressure loss as well as the efficiency of cooling the chips, which can be placed on the top of LTCC substrate.