Material technology for 2.5D/3D package

Kazuyuki Mitsukura,Tatsuya Makino,Keiichi Hatakeyama,Kenneth June Rebibis,Teng Wang,Giovanni Capuz,Fabrice Duval,Mikael Detalle,Andy Miller,Eric Beyne

Material technology for 2.5D/3D package

2015

Kazuyuki Mitsukura
Tatsuya Makino
Keiichi Hatakeyama
Kenneth June Rebibis
Teng Wang
Giovanni Capuz
Fabrice Duval
Mikael Detalle
Andy Miller
Eric Beyne

Packaging material is one of the key components for through-silicon via (TSV) 2.5D/3D package giving a strong impact on the higher density integration and its reliability.

Keywords:

Engineering
Chip-scale package
Scanning electron microscope
Electronic engineering
Electrical engineering
Integrated circuit packaging
Dielectric
material technology

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