3D Modular Power Electronic Packages and Modules for different power classes - from 50W to 50kW

This paper will describe the use of embedded die technologies for various application fields. The main focus of the paper will be the development work within the European funded project EmPower, which concentrates on power electronic applications. Here, three different power levels are of interest: 50W single die packages with fast rectifier diodes 500W power modules for electric bicycle application 50kW power modules for HEV and EV application All three application fields are based on a similar concept. The so called power core provides the base for the package/module. This power core contains the embedded semiconductor(s) and is manufactured using printed circuit board processing on a large panel format of 18 by 24 inches. Electrical contacts to the embedded dies are made by laser drilled micro vias and copper filling. A major advantage of such a direct copper contact, compared to the conventionally used wire bond, is its high reliability and the improved electrical performance. By the reduction of the ...