Old Web
English
Sign In
Acemap
>
Paper
>
Investigation of InP/Si bonding characteristics of Ar-FAB surface activated bonding for hybrid integration
Investigation of InP/Si bonding characteristics of Ar-FAB surface activated bonding for hybrid integration
2018
Kumi Nagasaka
Junichi Suzuki
Takuya Mitarai
Yuning Wang
Tomohiro Amemiya
Nobuhiko Nishiyama
Shigehisa Arai
Keywords:
Photoluminescence
Surface activated bonding
Photochemistry
Direct bonding
Materials science
Chemical engineering
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]