High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging

This paper presents a high-Q and high dynamic range timing and inertial measurement unit chip (TIMU) fabricated in a 3D nano-gap DRIE process and wafer-level-packaged (WLP) using a hermetic TSV interposer. The SOI-based fabrication platform enables integration of high-frequency resonator arrays with very high Qs approaching 200,000 that are acoustically decoupled from one another and exhibit no cross-talk. In-plane and out-of-plane gyroscopic resonators are dynamically tuned to form tri-axial Coriolis gyroscopes with unprecedented sensitivity levels. Advanced interface circuit architectures provide for self-calibration of high-Q gyroscopes, hence reducing drift substantially. High bandwidth and high dynamic range tri-axial accelerometers with micro-gravity resolution enable new wearable applications in osteo and cardiopulmonary health monitoring.