Low temperature wafer bonding technologies

This paper will give an overview on up to date research results for wafer bonding technologies using heterogeneous substrate materials and advanced activation treatments. The following descriptions give a short introduction to certain bonding technologies focusing on low processing temperature. As examples direct and anodic bonding technologies were chosen and presented as part of the fabrication process for RF-MEMS. Furthermore the paper will show the theoretical aspects of the single bonding procedure as well as the experiments and the results of the development.