Integration of III-V on Silicon Gain Devices At the Backside of Silicon-on-Insulator Wafers For Photonic Fully Integrated Circuits
2020
We present a new platform integrating heterogeneous III-V/silicon gain devices at the backside of silicon-on-insulator wafers. The fabrication relies on commercial silicon photonic processes. The performances of lasers and SOAs fabricated accordingly are reported.
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