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Studies on the Interfacial Reaction of Screen-Printed Sn-37Pb,Sn-3.5Ag and Sn-3.8Ag-0.7Cu Solder Bumps on Ni/Au and OSP finished PCB
Studies on the Interfacial Reaction of Screen-Printed Sn-37Pb,Sn-3.5Ag and Sn-3.8Ag-0.7Cu Solder Bumps on Ni/Au and OSP finished PCB
2002
나재웅
손호영
백경욱
김원희
허기록
Keywords:
Soldering
Composite material
Metallurgy
Materials science
Correction
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