Temporary adhesion method and a manufacturing method of a thin wafer

The present invention provides a method of temporary adhesion, the adhesive material interposed therebetween to temporarily wafer temporarily adhered to the support member, using a temporary adhesive material comprising a composite layer of a wafer processing adhesive material as the material temporarily. The material layer having: a thermoplastic resin layer (A), stored at 25 ℃ elastic modulus E 'is 1 ~ 500MPa, tensile breaking strength is 5 ~ 50MPa; thermosetting polymer layer (B), at 25 deg.] C after curing E 'is 1 ~ 1000MPa, tensile strength at break is 1 ~ 50MPa. The method comprising: bonding step of "forming a wafer layer (A) and by laminating a film-like resin (B form) using the liquid composition (A) 'under reduced pressure to a surface of support layer (B), heat bonding, or by forming a layer (a) and forming a surface layer (B) of the wafer and the support body is heated under reduced pressure bonded to the layer (a); thermal curing step, the layer (B ) heat curing.