Study on the Thermal Performance of VSC-HVDC Cooling Plate Using Staggered Micro-Groove

A cooling plate with staggered micro-groove structure was designed to replace traditional straight groove structure which cannot meet the VSC-HVDC cooling requirement. On the basis of reasonable physical and mathematical models, the thermal process was simulated based on Icepak, and experiments were designed to verify the reliability of the numerical simulation results. Results showed that the thermal resistance of experimental is 0.00538K/W and pressure drop is 1.03bar, which can meet the technical requirement; The differences of pressure drop and thermal resistance between simulation and test results are 9.4% and 7.4% respectively. It also provides an important method for the design and improvement of cooling plate in engineering application.