Process considerations in the integration of HDPCVD films

HDPCVD films can be used in a number of different applications in the IC manufacturing. Void free gap fill is the main advantage of the process. The main applications of these films are shallow trench isolation, premetal dielectric, intermetal dielectric and passivation. The processing requirements for these applications, however, are significantly different. In this paper the process considerations in the integration of HDPCVD films for these different applications are presented.