Macro-channel liquid-cooling high-power semiconductor laser module and apparatus

The invention proposes a macro-channel liquid-cooling high-power semiconductor laser module and an apparatus formed by combining multiple modules. A unique heat sink design is combined with a chip set, so that the laser module is good in structural property and high in heat dissipation efficiency. The macro-channel liquid-cooling high-power semiconductor laser module comprises a heat sink and the chip set, wherein each laser chip of the chip set is bonded on a corresponding heat-conducting and conductive substrate; the laser chips and the chip substrates are stacked in sequence and form electric connection; the substrates are mounted on the same heat sink through insulation layers; and in the stacking direction of the laser chips and the substrates, a water inlet and a water outlet parallel to each other are formed in the side surfaces of the heat sink perpendicular to a mounting surface of the chip set in a run-through manner, and a liquid cooling loop of a macro-channel is arranged in the heat sink. The multiple modules can be conveniently and mechanically assembled and maintained to realize elastic power extension; and each module serves as a functional unit and can truly perform testing, aging and screening in a working state to realize the optimization performance of a final product.