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Wafer level LED packaging with optimal light output and thermal dissipation for high-brightness lighting
Wafer level LED packaging with optimal light output and thermal dissipation for high-brightness lighting
2014
Liang Wang
Gabe Guevara
Hala Shaba
Roseann Alatorre
Rey Co
Ron Zhang
Keywords:
Composite material
Electronic engineering
Thermal
Wafer backgrinding
Materials science
Dissipation
Brightness
Wafer
thermal dissipation
Optoelectronics
led packaging
Correction
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