Welding protection structure of flip LED chip

2013 
The invention relates to a flip LED chip, in particular to a welding protection structure of the flip LED chip, and aims to prevent direct short circuit or electric leakage between P and N during flip solid crystal welding of the flip LED chip, so that the welding protection structure of the flip LED chip is provided. A first side wall of the chip is provided with both a P type layer and an N layer and is characterized in that a chip bottom surface and a substrate bottom surface are covered with an insulated passivation layer of the first side wall. During flip solid crystal welding of the chip, even if solder overflows and climbs upward, short circuit or electric leakage cannot happen to the P type layer and the N layer on the side due to the fact that the passivation layer performs insulation protection on the side wall of the chip.
    • Correction
    • Source
    • Cite
    • Save
    • Machine Reading By IdeaReader
    0
    References
    0
    Citations
    NaN
    KQI
    []