The use of buried technology in microsystem packaging achieves the new type of electronic band gap

Novel two-dimensional EBG is put forward to suppress the simultaneous switching noise of electronic systems, Based on the inductance enhanced by the development of the micro system substrate embedded technology in recent years in the long-linemetal between adjacent unit cell, the novel two-dimensional EBG structure is achieved by the units lattice structure, which is made of the connection of a square metal and two metal serpentine lines. Simulation results show that the stopband bandwidth of new EBG structure labeling on capacitor is 0 ∼ 8GHz (S 21 ≤ −15dB)in the same parameters EBG classic.