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Characterization of CMP Process at Single Contact Point of Pad Micro-Asperity
Characterization of CMP Process at Single Contact Point of Pad Micro-Asperity
2020
Hyun Jun Ryu
Dong-Geun Kim
Sukkyung Kang
Ji Hun Jeong
Sanha Kim
Keywords:
Materials science
Process (computing)
Chemical-mechanical planarization
Contact mechanics
characterization
Composite material
asperity
Point (geometry)
Correction
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