Immingled filling material filled polyurethane modified epoxy resin embedding material and preparation method

The invention relates to polyurethane modified epoxy resin encapsulating material filled with promiscuous padding and the preparation method, in particular to epoxy resin encapsulating material prepared by adopting the promiscuous padding mixed by glass fiber power (MG) and SiO2 or AIN and the TDE-85 epoxy resin modified by polyurethane and the preparation method thereof. By adopting the polyurethane to toughen and modify the TDE-85 epoxy resin basal body, and adopting methyl tetrahydrophthalic anhydride methpa as the curing agent, 1,4-butylene-glycol as the chain extender, trimethylol propane as the crosslinking agent, 2,4,6-tris(dimethylamino methyl) phenol as the curing accelerator, and the mixture of the MG and the SiO2 or the AlN as the padding, the epoxy resin encapsulating material is made by evenly mixing the components according to the prescriptive mass ratio, which had good technical performance, in particular to the mechanical property. The experiment indicates that the promiscuous padding can effectively make up for the performance defects of the epoxy resin encapsulating material filled with single particle padding, and has good integrated performance.