Composite electroplating of Cu–SiO2 nano particles on carbon fiber reinforced epoxy composites

Abstract The main purpose of this work is to co-deposit nano-SiO 2 particles into the copper coatings on carbon fiber reinforced epoxy (C/EP) composite surface by electrodeposition method in order to improve the micro hardness of coatings. C/EP composites are copper plated with sulfuric acid based solution, and the effects of nano-SiO 2 and C 6 H 12 O 6 in the electrolyte contents on the copper coatings are investigated. It is found that crystalline grains of coatings are markedly refined by nano-SiO 2 in the acidic sulfate copper plating bath and the ceramic particles cause an increase in hardness of coatings though nano-SiO 2 results in a decline of deposition rate and a decrease in electrical conductivity of electroplating layers. Otherwise, C 6 H 12 O 6 in the plating bath is indispensable to the layer formation even though nano-SiO 2 added. These results demonstrate that the hardness of coatings will be increased with appropriate contents of co-deposited SiO 2 and C 6 H 12 O 6 in the plating bath.