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Configuration for High-speed Transmission between Flip-chip Packages Using Low Loss and Flexible Substrate
Configuration for High-speed Transmission between Flip-chip Packages Using Low Loss and Flexible Substrate
2018
Tomoyuki Akahoshi
Daisuke Mizutani
Kaoru Sugimoto
Hiroaki Kouzai
Mitsuhiro Watanabe
Keywords:
Skew
Electronic engineering
Materials science
Substrate (chemistry)
Flip chip
Eye pattern
Flexible electronics
Signal integrity
Transmission (mechanics)
Optoelectronics
differential line
Correction
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