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Full CMP Integration of TiN Damascene Metal Gate Devices
Full CMP Integration of TiN Damascene Metal Gate Devices
2000
H. Achard
F. Ducroquet
F. Coudert
B. Previtali
J.F. Lugand
L. Ulmer
T. Farjot
Y. Gobil
M. Heitzmann
S Tedesco
M.E. Nier
S. Deleonibus
Keywords:
Boron
Capacitor
Metal gate
Electronic circuit
Copper interconnect
Electronic engineering
Materials science
Tin
Fabrication
Dielectric
Correction
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