Optoelectronic chip on film (OE-COF) packaging technology

Optoelectronic chip on film (OE-COF) packaging technology has been developed to meet next-generation OE packaging demands. LSIs and optical devices such as VCSELs and photodiodes are flip-chip bonded on the OE film using microsolder bumps. The bottom surfaces of the devices are die-bonded on a substrate or a package. Optical devices and optical waveguides are optically interconnected using 45-degree reflection mirrors. LSIs and optical devices are electrically interconnected through electrical lines via microsolder bumps with or without vias. OE film is optically coupled to input/output optical connectors at the edges.