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Electrochemical Migration in Three Layer TAB Tape with Tin-plated Lead
Electrochemical Migration in Three Layer TAB Tape with Tin-plated Lead
1995
Koji Shibasaki
Chiaki Takubo
Hiroshi Tazawa
Eiichi Hosomi
Toshio Sudo
Morihiko Ikemizu
Y.Hiruta Y.Hiruta
Keywords:
Copper
Tin
Materials science
Metallurgy
Electrochemical migration
Dendrite
Correction
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