Micro-structure and NTCR Characteristics of Copper Manganite Thin Films Fabricated by MOD Process

Copper manganite thin films were fabricated on substrate by metal organic decomposition (MOD) process. They were burned-out at and annealed at various temperatures () for 1h in ambient atmosphere. Their micro-structure and negative temperature coefficient of resistance (NTCR) characteristics were analyzed for micro-bolometer application. The copper manganite film with a cubic spinel structure was well developed at which confirmed by XRD and HRTEM analysis. It showed a low resistivity () at room temperature and high NTCR characteristics of and at room temperature and , implying a good thin film for micro-bolometer application. Furthermore, its crystallinity was enhanced with increasing temperature to . However, the appearance of secondary phase at temperatures higher than lead to deteriorate the NTCR characteristics.