Manufacturing method of electronic parts modules

Provided is a manufacturing method of electronic parts modules which can produce compact electronic parts modules by effectively using the space on the circuit board surface, can produce a thinner conductive film formed on a sealing resin layer surface, and can reliably shield the surface-mounted parts mounted on the circuit board. An assembly board which forms a plurality of electronic parts modules is prepared. At least one conductive post is formed on the surface-mounted parts mounted in the plurality of electronic parts modules. The assembly board is sealed as a whole by resin so that parts of the conductive posts are exposed from the top surface of the sealing resin layer. Notches having the specified depth from the top surface of the sealing resin layer are formed on the boundaries of the electronic parts modules. After a conductive paste is coated on the top surface of the sealing resin layer and in the notches, spin coating is used to form a conductive thin film connected to the conductive posts. Then the electronic parts modules are cut off along the notches.