Scanning ion deep level transient spectroscopy: II. Ion irradiated Au–Si Schottky junctions

Here we introduce a new technique called scanning ion deep level transient spectroscopy (SIDLTS) for the spatial analysis of electrically active defects in devices. In the first part of this paper, a simple theory behind SIDLTS was introduced and factors determining its sensitivity and resolution were discussed. In this paper, we demonstrate the technique on MeV boron implantation induced defects in an Au–Si Schottky junction. SIDLTS measurements are compared with capacitance DLTS measurements over the temperature range, 100–300 K. SIDLTS analyses indicate the presence of two levels, one of which was positively identified as the Ec − 0.23 eV divacancy level. The high sensitivity of SIDLTS is verified and the advantages and limitations of the technique are discussed in light of non-exponential components in the charge transient response. Reasons for several undetected levels are also discussed. (Some figures in this article are in colour only in the electronic version)