Encapsulating structure with clamping and ESD (Electro-Static Discharge) protection

The invention provides an encapsulating structure with clamping and ESD (Electro-Static Discharge) protection. The encapsulating structure is connected between a chip PAD and a circuit, can play a role in voltage clamping, and forms a current discharge channel for periodic low-energy pulse peak signals in signals accessing to the chip PAD. The encapsulating structure can play a role in ESD protection, and forms a current discharge channel for periodic low-energy pulse peak signals. The area of a chip is saved, and the production cost is reduced.