Mismatch Constraint Effect for Bimaterial Interfacial Creep Crack

Mismatch effect of weldments is important for the assessment of structural integrity at elevated temperature. The interfacial creep crack is a common model which can be found in lots of engineering practices. Recently, the constraint effect is also considered to be significant for the evaluation of creep crack growth under high temperature. In this paper, a model for bimaterial interfacial creep crack is introduced to study the mismatch constraint effect. The stress field for bimaterial interfacial creep crack is investigated. An M*-parameter is proposed to characterize the constraint effect caused by material mismatch for bimaterial creep crack. A comparison is made between the geometry constraint caused by specimen loading and mismatch constraint caused by inhomogeneous material.