Old Web
English
Sign In
Acemap
>
Paper
>
Detailed Thermal, Fire, and Mechanical Study of Silicon-Modified Epoxy Resin Containing Humic Acid and Other Additives
Detailed Thermal, Fire, and Mechanical Study of Silicon-Modified Epoxy Resin Containing Humic Acid and Other Additives
2021
Virginia Venezia
Samuele Matta
Sandro Lehner
Giuseppe Vitiello
Aniello Costantini
Sabyasachi Gaan
Giulio Malucelli
Francesco Branda
Giuseppina Luciani
Aurelio Bifulco
Keywords:
Epoxy
Silicon
Thermal
Chemical engineering
Humic acid
Materials science
Correction
Source
Cite
Save
Machine Reading By IdeaReader
68
References
0
Citations
NaN
KQI
[]