Mechanistic studies of SC-1 particle removal and post piranha rinsing

SC-1 (NH{sub 4}OH/H{sub 2}O{sub 2}/H{sub 2}O) and piranha (H{sub 2}SO{sub 4}/H{sub 2}O{sub 2}) cleans have been used for many years to remove particulate and organic contamination. Although the SC-1 clean, often used with applied megasonic power, is known to be highly effective for particle removal, the removal mechanism remains unclear. For the removal of heavy organic contamination, the piranha cleaning chemistry is an effective process; however, post-piranha residue adheres tenaciously to the wafer surface, causing a particle growth phenomenon. A series of experiments have been performed to help understand the interaction of these processes with silicon surfaces.