Efficient TSV repair method for 3D memories

Through-silicon-via (TSV) based 3D stacked memory is recognized as the next generation memory architecture but its low TSV yield is one of the manufacturing cost factors. In this paper, an efficient TSV repair method is proposed for 3D memories. The proposed method uses a new 2-dimensional 1-4 switching technique to enable efficient repair of clustered TSV faults using repair circuitry with reasonable area overhead. Therefore, the proposed TSV repair method can contribute the improvement of TSV yield for 3D memories.