Metal lead frame structure with low test cost and manufacturing method thereof

The invention relates to a metal lead frame structure with a low test cost and a manufacturing method thereof, which belong to the technical field of semiconductor packaging. The metal lead frame structure comprises multiple units; each unit comprises a pin; the pin comprises a first metal layer (1) and a second metal layer (2); the second metal layer (2) is arranged on the front face of the first metal layer (1); gaps between the pins are filled with molding compounds (4); third metal layers (3) are arranged on the back face of the first metal layer (1) and the front face of the second metal layer (2); a groove (5) is arranged between pins of adjacent two units; and the groove (5) separates the pins of the adjacent two units. According to the metal lead frame structure with a low test cost and the manufacturing method thereof provided by the invention, a whole-process testable ability can be brought, the test cost can be greatly reduced, and the quality and the efficiency are improved.