Taming the coupling effects during the design of multilayered substrates

This paper presents a novel approach for an electrical simulation tool to control the signal integrity in the bulk of any multilayered substrate when routing process is carried on a CAD workstation to achieve building-in quality and reliability for high density interconnections. These innovative features are found in the topological approach of the whole set of interconnections subject to electromagnetic interferences in the substrate such as a PCB. The lossy transmission line equations are solved in the time-domain using wavelets-like functions, which leads to save CPU-time and memory space when compared to the classical Fourier transform. This software is merged into a PCB-CAD workstation to offer the capability of performing in real time a crosstalk-free design.