The method of manufacturing a chip packaging structure
2011
The present invention provides a method of manufacturing a chip package structure. The manufacturing method comprising: providing a protective layer; forming a wiring layer on the protective layer; forming an adhesive layer on the conductive circuit layer; placing a chip on the adhesive layer; and a chip electrically connected to the conductive wiring layer. Accordingly, the manufacturing method of manufacturing a chip package structure can have a smaller thickness.
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