A mounting assembly of a plurality of power semiconductors, and circuit having such a mounting arrangement

Disclosed is an electrical circuit comprising one or more power semi-conductor (4) having a heat releasing contact surface, with which they are in SMT-technique on a circuit supporting plate (1) is mounted. According to the invention it is provided that the at least one power semiconductor (4) on a metallic intermediate carrier (5) is mounted with SMT-technique, which of the circuit supporting plate (1).